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Material Detail

From Wafer to Package

From Wafer to Package

This website includes an animation of finished wafer to packaged integrated Circuits. Objective: Describe the wafer to packaged device process steps. This simulation is from Module 075 of the Process & Equipment III Cluster of the MATEC Module Library (MML). You will find the animation under the heading "Process & Equipment III." To view other clusters or for more information about the MML visit http://matec.org/ps/library3/process_I.shtmlKey
Keywords:
stem education, workforce development, technician training, advanced technological education
Disciplines:
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More about this material

Material Type:
Presentation
Date Added to MERLOT:
July 18, 2016
Date Modified in MERLOT:
July 18, 2016
Author:
Submitter:
Barbra Bied Sperling
Hispanic Serving Institution
Primary Audience:
Grade School, Middle School, High School, College General Ed, College Lower Division, College Upper Division, Graduate School, Professional
Technical Format:
Website, Flash
Mobile Compatibility:
Not specified at this time
Language:
English
Cost Involved:
No
Source Code Available:
No
Accessibility Information Available:
Unknown
Creative Commons:
No

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